Abstract:

With the rapid development of 5G communication, high-performance computing (HPC), and Internet of Things (IoT) technologies, high-speed connectors, as the core components of signal transmission, directly affect the overall system performance in terms of their performance. This article analyzes the design challenges of high-speed connectors in terms of signal integrity, electromagnetic compatibility, material selection, and miniaturization, explores current mainstream technological solutions, and looks forward to future development trends.

Keywords: high-speed connector; Signal integrity; Impedance matching; High frequency materials; Future Trends

1. Introduction

High speed connectors (usually defined as connectors with transmission rates ≥ 10 Gbps or frequencies ≥ 1 GHz) are an essential component of modern electronic systems. Its applications in data centers, autonomous driving, aerospace, and other fields require connectors to have low loss, high reliability, and anti-interference capabilities. With the development of transmission rates towards 56 Gbps, 112 Gbps, and even higher, traditional connector designs are facing severe challenges.

2. Key technical challenges of high-speed connectors

2.1 Signal Integrity (SI) Issues

Impedance matching: High speed signals are prone to reflection due to impedance discontinuity during transmission, and impedance fluctuations (typical value ± 10%) need to be controlled by optimizing the connector structure (such as differential pair design, grounding shielding).

Insertion loss and return loss: Dielectric loss and conductor loss are exacerbated at high frequencies, requiring the use of low dielectric constant (Dk) and low loss factor (Df) materials.

2.2 Electromagnetic Compatibility (EMC)

High frequency crosstalk can be suppressed by adding isolation slots and optimizing pin layout (such as orthogonal interleaving).

Radiation noise control needs to be combined with shielding shell design and common mode filtering technology.

2.3 Miniaturization and High Density

The development of spacing from 0.5 mm to 0.3 mm places higher demands on precision manufacturing processes such as stamping and injection molding.

3. Current technological solutions

3.1 Material Innovation

Matrix materials: High frequency materials such as liquid crystal polymer (LCP) and polytetrafluoroethylene (PTFE) are widely used.

Plating technology: Selective gold plating (contact area) combined with nickel plating (shielding area) to balance cost and performance.

3.2 Structural Design Optimization

Differential pair layout: For example, Samtec's "Eye Speed" series adopts a twisted pair embedded design to reduce crosstalk.

3D modeling and simulation: HFSS or CST tools are used to pre study the S-parameter characteristics of signal paths.

3.3 Standardization and Testing

IEC 60512-28 and other standard specifications for high-frequency testing methods (such as TDR time-domain reflection method).

4. Future Development Trends

Co encapsulated optical (CPO) interface: optoelectronic hybrid connector or a solution for transmission above 800G.

Intelligent connector: Integrated sensors for real-time monitoring of temperature rise, vibration, and other states.

Sustainable design: halogen-free materials and modular detachable structures.

5. Conclusion

The performance improvement of high-speed connectors requires interdisciplinary collaborative innovation. In the future, with the maturity of silicon optical technology and advanced packaging processes, connectors will develop towards higher integration and lower power consumption, providing hardware support for 6G communication and quantum computing.